Six Multilayer PCB Circuit Board for Communication Terminals

• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Dielectric: FR-4
• Base Material: Aluminum
• Insulation Materials: Epoxy Resin
• Processing Technology: Electrolytic Foil
• Model NO.: 1PXMDO10689
• Application: Consumer Electronics
• Mechanical Rigid: Rigid
• Material: Fiberglass Epoxy
• Brand: Shengyi, Kb, Nanya, Ilm
• Criteria: Aql II 0.65
• Hole Sizes: 0.15mm/0.2mm
• Bevel Edge: Yes
• Impedance: 50/90/100 Ohm
• Trace Width(Min.): 6mil
• Surfaec Treatment: OSP
• Transport Package: Vacuum Packaging
• Specification: 80*80mm
• Trademark: XMANDA
• Origin: Made in China
• HS Code: 8534001000
• Production Capacity: 50000sqm/Month

Product Description

 

Product Description:

 

Specifications:

 

• Layers: 1


• Thickness: 1.6mm


• Material: FR4 KB6165


• Size: 80*80mm


• Surface treatment: osp


• Line width/spacing: 6/6mil


• Minimum aperture: 0.25mm


• Solder mask color: White


• Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ
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Features:

 

1. The board design offers high integration with a thickness-to-diameter ratio exceeding 10:1, posing challenges in copper electroplating.


2. Made of TG170 material.





 
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About Us:

 

Shenzhen Xinmanda Printed Circuit Board Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With advanced production equipment and technical collaborations, we have expanded our capabilities in double-sided and multi-layer board production. We export globally and have a new production line in Jiangxi Ji'an for batch orders.

 

Key Highlights:

 

• Monthly production capacity of 50,000 sqm of PCBs.


• One-stop solutions for PCB & PCBA.


• Over 12 years of experience in PCB manufacturing.


• Average response time of ≤24 hours with experienced engineers.


• Compliance with RoHS, TS16949, ISO9001, and UL certifications.


• Flexible shipment arrangements.





 
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Production Advantages:

 

• Utilization of automation and digitization for enhanced efficiency and cost reduction.


• Usage of high-quality, traceable branded raw materials.


• State-of-the-art production equipment ensuring quality and meeting technical requirements.


• Implementation of intelligent systems for improved production processes.


• Stringent inspection procedures including 100% AOI testing and quality control measures.





 
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Our Capabilities and Technology
Items		2022	2023
Layers		(MP):22layer,(Sampling):32 layer	(MP):32layer
Max. Board THK		Sampling 4.0mm / MP :3.2mm	Sampling 5.0mm / MP:3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ~ 6OZ	1/3~8 OZ
	Outer layer	1/3 ~ 6 OZ	1/3 ~ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tolerances	PTH	±0.076mm	±0.05mm
	NPTH	±0.05mm	±0.03mm
Solder mask opening		0.05mm	0.03mm
Solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP:±0.1mm	Sampling:±0.075mm /MP:±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
(pitch)(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Special process		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.