Type: | Rigid Circuit Board |
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Flame Retardant Properties: | V0 |
Dielectric: | FR-4 |
Base Material: | Aluminum |
Insulation Materials: | Epoxy Resin |
Processing Technology: | Electrolytic Foil |
Samples: |
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Customization: |
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Shenzhen Xinmanda Printed Circuit Board Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With advanced production and testing equipment, technical collaborations, and expansion of process capacity, we have been serving clients globally since 2011. Our production facility in Jiangxi Ji'an added a new line in 2018 to cater to batch orders.
Key Highlights:
Our professional team utilizes automation and digitization to enhance PCB production efficiency and reduce procurement costs. We ensure high-quality raw materials, standardized procurement processes, strict supplier selection policies, and employ high precision processing equipment for quality assurance. Our intelligent systems and strict inspection procedures guarantee top-notch PCBs.
Our Capabilities and Technology | |||
Items | 2022 | 2023 | |
Layers | (MP):22layer,(Sampling):32 layer | (MP):32layer | |
Max. Board THK | Sampling 4.0mm / MP :3.2mm | Sampling 5.0mm / MP:3.2mm | |
Min. Board THK | Sampling :0.4mm /MP :0.5mm | Sampling: 0.3mm / MP:0.4mm | |
Base copper | Inner layer | 1/3 ~ 6OZ | 1/3~8 OZ |
Outer layer | 1/3 ~ 6 OZ | 1/3 ~ 8 OZ | |
Borehole diameter | Min.PTH | 0.2mm | 0.15mm |
Max. aspect ratio | 10:01 | 12:01 | |
HDI aspect ratio | 0.8:1 | 1:01 | |
Tolerances | PTH | ±0.076mm | ±0.05mm |
NPTH | ±0.05mm | ±0.03mm | |
Solder mask opening | 0.05mm | 0.03mm | |
Solder dam | (Green) 0.076mm , | (Green) 0.076mm , | |
(other color) 0.1mm | (other color) 0.08mm | ||
Min. core THK. | 0.1mm | 0.08mm | |
Bow&twist | ≤0.5% | ≤0.5% | |
Routing Tol. | Sampling :±0.075mm /MP:±0.1mm | Sampling:±0.075mm /MP:±0.075mm | |
Impedance Tol. | ±10% | ±8% | |
Min. w/s (Inner layer) | 0.075 / 0.075mm | 0.075 / 0.075mm | |
Min. w/s (Outer layer) | 0.075 / 0.075mm | 0.075 / 0.075mm | |
(Min. BGA size) | 0.2mm | 0.15mm | |
(pitch)(Min. BGA Pitch) | 0.65mm | 0.5mm | |
(Working panel size) | 600mm*700mm | 600mm*700mm | |
Special process | Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |
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