Multi-Layered Advanced Radio Transmission Circuit

• Structure: Multilayer Rigid PCB
• Dielectric: FR-4
• Material: Polyester Glass Fiber Mat Laminate
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Model NO.: 4PXMDL15442
• Production Process: Semi-Additive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Shengyi, Kb, Nanya, Ilm
• Criteria: Aql II 0.65
• Hole Sizes: 0.25mm
• Bevel Edge: Yes
• Impedance: 50/90/100 Ohm
• Trace Width(Min.): 4mil
• Surfaec Treatment: Enig
• Transport Package: Vacuum Packaging
• Specification: 40*80mm
• Trademark: XMANDA
• Origin: Made in China
• HS Code: 8534009000
• Production Capacity: 50000sqm/Month

Product Description

Product Specifications:

• Layers: 4
• Thickness: 0.6-1.6mm
• Material: FR4 KB6160
• Size: 40*80mm
• Surface treatment: ENIG
• Line width/spacing: 5/5mil
• Minimum aperture: 0.25mm
• Solder mask color: Green
• Finished copper thickness: 1/1 OZ

   

  
   

  
  

  

  
   
  

  

  

Features:

1. The integration of the board design is very high, with a thickness-to-diameter ratio exceeding 10:1, and high difficulty in electroplating of copper.
2. Made of TG140 material.

About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:

• Founded in 2009 in Shenzhen, China.
• Expanded process capacity for double-sided and multi-layer boards.
• Exports orders worldwide since 2011.
• New production line in Jiangxi Ji'an for batch orders in 2018.

Company Capabilities:

• Monthly production capacity of 50,000 sqm of PCBs.
• One-stop solutions for clients (PCB & PCBA).
• Over 12 years of experience in PCBs.
• Compliance with RoHS, TS16949, ISO9001, and UL certifications.
• Flexibility in shipment arrangements.

Production Advantages:

• Professional team utilizing automation and digitization for improved efficiency and reduced costs.
• High-quality raw materials with traceable sources.
• Standardized procurement process and strict supplier selection policy.
• High precision processing equipment ensuring quality.
• Intelligent systems for various technical processes.
• Strict inspection with 100% AOI testing and FQA/FQC.

For more information, contact Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

 

Our Capabilities and Technology
Items		2022	2023
Layers		(MP):22layer,(Sampling):32 layer	(MP):32layer
Max. Board THK		Sampling 4.0mm / MP :3.2mm	Sampling 5.0mm / MP:3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ~ 6OZ	1/3~8 OZ
	Outer layer	1/3 ~ 6 OZ	1/3 ~ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tolerances	PTH	±0.076mm	±0.05mm
	NPTH	±0.05mm	±0.03mm
Solder mask opening		0.05mm	0.03mm
Solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP:±0.1mm	Sampling:±0.075mm /MP:±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
(pitch)(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Special process		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.