| Dielectric: | AIN |
|---|---|
| Substrate Material: | 96%, 99.6% Alumina |
| Surface Metallization Process: | Electroless Nickel Plating Process |
| Feature: | Excellent Electrical and Thermal Properties |
| Usage: | to Realize Electrical Connections |
| Transport Package: | Vacuum & Carton |
| Customization: |
|---|
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